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Ceramic Packages / Ceramic Substrates

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Ceramic Packages

Technical Support

Simulation Technology

Kyocera’s simulation technologies can help optimize package designs for demanding requirements.

Sealing Options

Choosing the right sealing method can enhance reliability and performance.

Chip- and Board-Level Assembly Options

Package structure options offer flexibility to optimize your chip- and board-level assembly.

Delivery Options

Select from a variety of shipping form options to suit your existing production lines.

Others

Low Electrical Loss

This page introduces LTCC materials with excellent high-frequency characteristics, along with Kyocera's design support services.

Ceramic Package Miniaturization

Miniaturization is achieved through the development of high-strength materials and improvements in processing technologies.

Hermetic Sealing

This page provides an overview of hermetic sealing technologies for protecting components from the external environments.

High Thermally Conductive Ceramics

By using materials with high thermal conductivity, heat generated by components is effectively dissipated.

Matching Coefficients of Thermal Expansion

By considering the thermal expansion coefficient matching between different materials, we contribute to improved device reliability and stress relief for components.

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