This page introduces LTCC materials with excellent high-frequency characteristics, along with Kyocera's design support services.

Miniaturization is achieved through the development of high-strength materials and improvements in processing technologies.

This page provides an overview of hermetic sealing technologies for protecting components from the external environments.

By using materials with high thermal conductivity, heat generated by components is effectively dissipated.

By considering the thermal expansion coefficient matching between different materials, we contribute to improved device reliability and stress relief for components.