High-Frequency / RF Device Packages, Lids, and Substrates
Ceramic Packages Support Wireless Communication Infrastructure
Kyocera supplies ceramic packages for power amplifiers used in wireless communication, including mobiles phones base stations, and for high-frequency applications such as weather radars.
Enhancing High-Frequency Performance and Thermal Management
Kyocera provides ceramic package options to optimize high-frequency performance for wireless communication applications, including RF power transistors, thin-film MICs, and MMICs, with specialized lids engineered for each package type.
*MIC: Microwave Integrated Circuit
*MMIC: Monolithic Microwave Integrated Circuit
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